AMD Phenom II X3 B75 - HDXB75WFK3DGM information

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Type:CPU	Manufacturer:AMD
family:Phenom II X3	microprocessors:AMD Phenom II X3 B75 - HDXB75WFK3DGM

Type	CPU / Microprocessor
Market segment	Desktop
Family	AMD Phenom II X3
Model number	B75
CPU part number	HDXB75WFK3DGM is an OEM/tray microprocessor
Stepping code	CACDC AC
Frequency	3000 MHz
Bus speed	667 MHz Memory controller One 2000 MHz 16-bit HyperTransport link (4 GT/s)
Clock multiplier	15
Package	938-pin organic micro-PGA
Sockets	Socket AM2+ Socket AM3
Architecture / Microarchitecture
Microarchitecture	K10
Platform	Dragon
Processor core	Heka
Core stepping	RB-C3
CPUID	100F43
Manufacturing process	0.045 micron silicon-on-insulator (SOI) technology
Die size	258mm²
Data width	64 bit
The number of cores	3
The number of threads	3
Floating Point Unit	Integrated
Level 1 cache size	3 x 64 KB 2-way set associative instruction caches 3 x 64 KB 2-way set associative data caches
Level 2 cache size	3 x 512 KB 16-way set associative exclusive caches
Level 3 cache size	Shared 6 MB 48-way set associative cache
Cache latency	3 (L1 cache)
Multiprocessing	Uniprocessor
Features	MMX instructions Extensions to MMX 3DNow! technology Extensions to 3DNow! SSE / Streaming SIMD Extensions SSE2 / Streaming SIMD Extensions 2 SSE3 / Streaming SIMD Extensions 3 SSE4a AMD64 / AMD 64-bit technology EVP / Enhanced Virus Protection AMD-V / AMD Virtualization technology
Low power features	Cool'n'Quiet 3.0 CoolCore Technology Dual Dynamic Power Management Core C1 and C1E states Package S0, S1, S3, S4 and S5 states
Integrated peripherals / components
Integrated graphics	None
Memory controller	The number of controllers: 1 Memory channels: 2 Channel width (bits): 72 Supported memory: DDR2-1066, DDR3-1333 DIMMs per channel: up to 2 Maximum memory bandwidth (GB/s): 21.3
Other peripherals	HyperTransport 3 technology
Electrical / Thermal parameters
Thermal Design Power	95 Watt
Notes on AMD Phenom II X3 B75
Business class processor

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